| Opoiye ibere | ≥1 PCS |
| Didara ite | IPC-A-610 |
| Akoko asiwaju | 48H fun iyara; 4-5 ọjọ fun Afọwọkọ; Opoiye miiran pese nigbati o sọ |
| Iwọn | 50 * 50mm-510 * 460mm |
| Board Iru | Kosemi Rọ Kosemi-rọ Irin mojuto |
| Package Min | 01005(0.4mm*0.2mm) |
| Iṣagbesori Yiye | ± 0.035mm (± 0.025mm)Cpk≥1.0 |
| Dada Ipari | Asiwaju/dari HASL ỌFẸ, goolu immersion, OSP, ati bẹbẹ lọ |
| Apejọ Iru | THD (Thru-iho ẹrọ) / Conventional SMT (Imọ-ẹrọ-Oke) SMT & THD dapọ SMT-meji ati/tabi apejọ THD |
| Awọn nkan elo orisun | Bọtini Turnkey(Gbogbo awọn paati ti o wa nipasẹ ANKE), bọtini iyipada apa kan, Ti fi sii |
| BGA Package | BGA Dia 0.14mm, BGA 0.2MM ipolowo |
| Iṣakojọpọ paati | Reels, Ge teepu, Tube, Atẹ, Awọn ẹya alaimuṣinṣin |
| USB Apejọ | Awọn kebulu aṣa, awọn apejọ okun, wiwu / ijanu |
| Stencil | Stencil pẹlu tabi laisi fireemu |
| Apẹrẹ faili kika | Gerber RS-274X, 274D, Eagle ati AutoCAD's DXF, DWG BOM (Bill of Ohun elo) Gbe ati Gbe faili (XYRS) |
| Ayẹwo didara | Ayẹwo X-ray, AOI (Aládàáṣiṣẹ Ojú Ayẹwo), Idanwo iṣẹ-ṣiṣe (awọn modulu idanwo nilo lati pese) Idanwo sisun |
| SMT agbara | 3 Milionu-4 Milionu soldering pad / ọjọ |
| Agbara DIP | 100 ẹgbẹrun pin / ọjọ |
