Agbara Ifijiṣẹ
| Kosemi ọkọ agbara | |
| Nọmba awọn fẹlẹfẹlẹ: | 1-42 fẹlẹfẹlẹ |
| Ohun elo: | FR4 \ high TG FR4 \ Asiwaju free ohun elo \ CEM1 \ CEM3 \ Aluminiomu \ Metal mojuto \ PTFE \ Rogers |
| Ode Layer Cu sisanra: | 1-6OZ |
| Layer inu Cu sisanra: | 1-4OZ |
| Agbegbe iṣelọpọ ti o pọju: | 610 * 1100mm |
| Isanra igbimọ ti o kere julọ: | 2 fẹlẹfẹlẹ 0.3mm (12mil) 4 fẹlẹfẹlẹ 0.4mm (16mil) 6 fẹlẹfẹlẹ 0.8mm (32mil) Awọn ipele 8 1.0mm (40mil) Awọn ipele 10 1.1mm (44mil) 12 fẹlẹfẹlẹ 1.3mm (52mil) 14 fẹlẹfẹlẹ 1.5mm (59mil) Awọn ipele 16 1.6mm (63mil) |
| Iwọn to kere julọ: | 0.076mm (milionu 3) |
| Aaye to kere julọ: | 0.076mm (milionu 3) |
| Iwọn iho ti o kere julọ (iho ikẹhin): | 0.2mm |
| Ipin abala: | 10:1 |
| Iwọn iho liluho: | 0.2-0.65mm |
| Ifarada liluho: | +\-0.05mm(2mil) |
| Ifarada PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
| Ifarada NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
| Pari ifarada igbimọ: | Sisanra：0.8mm, Ifarada:+/-0.08mm |
| 0.8mm≤ Sisanra≤6.5mm, Ifarada+/-10% | |
| Afara soldermask ti o kere julọ: | 0.076mm (milionu 3) |
| Lilọ ati atunse: | ≤0.75% Min0.5% |
| Iwọn ti TG: | 130-215 ℃ |
| Ifarada ikọlu: | +/- 10%, min +/-5% |
| Itọju Ilẹ:
| HASL, LF HASL |
| Gold Immersion, Gold Filaṣi, ika goolu | |
| Fadaka Immersion, Tin Immersion,OSP | |
| Pipin goolu ti o yan, sisanra goolu to 3um(120u”) | |
| Erogba Print, Peelable S/M,ENEPIG | |
| Aluminiomu ọkọ agbara | |
| Nọmba awọn fẹlẹfẹlẹ: | Layer ẹyọkan, awọn ipele meji |
| Iwọn igbimọ ti o pọju: | 1500 * 600mm |
| Isanra igbimọ: | 0.5-3.0mm |
| Isanra bàbà: | 0,5-4 iwon |
| Iwọn iho ti o kere julọ: | 0.8mm |
| Ìbú tó kéré jù: | 0.1mm |
| Aaye to kere julọ: | 0.12mm |
| Iwọn paadi ti o kere julọ: | 10 micron |
| Ipari Ilẹ: | HASL,OSP,ENIG |
| Apẹrẹ: | CNC, Punching, V-ge |
| Ohun elo: | Oludanwo gbogbo agbaye |
| Flying Probe Ṣii/Onidanwo kukuru | |
| Maikirosikopu agbara giga | |
| Solderability Igbeyewo Apo | |
| Peeli Agbara idanwo | |
| Ṣii Volt giga & Oluyẹwo kukuru | |
| Cross Section igbáti Apo Pẹlu Polisher | |
| Agbara FPC | |
| Awọn ipele: | 1-8 fẹlẹfẹlẹ |
| Isanra igbimọ: | 0.05-0.5mm |
| Isanra bàbà: | 0.5-3OZ |
| Iwọn to kere julọ: | 0.075mm |
| Aaye to kere julọ: | 0.075mm |
| Ni nipasẹ iwọn iho: | 0.2mm |
| Iwọn iho laser ti o kere julọ: | 0.075mm |
| Iwọn iho ti o kere ju: | 0.5mm |
| Ifarada soldermask: | + \-0.5mm |
| Ifarada iwọn ipa-ọna to kere julọ: | + \-0.5mm |
| Ipari Ilẹ: | HASL,LF HASL, Fadaka Immersion, Gold Immersion,Flash Gold, OSP |
| Apẹrẹ: | Punching, Lesa, Ge |
| Ohun elo: | Oludanwo gbogbo agbaye |
| Flying Probe Ṣii/Onidanwo kukuru | |
| Maikirosikopu agbara giga | |
| Solderability Igbeyewo Apo | |
| Peeli Agbara idanwo | |
| Ṣii Volt giga & Oluyẹwo kukuru | |
| Cross Section igbáti Apo Pẹlu Polisher | |
| Kosemi & agbara | |
| Awọn ipele: | 1-28 fẹlẹfẹlẹ |
| Iru ohun elo: | FR-4(Tg giga, Ọfẹ Halogen, Igbohunsafẹfẹ giga) PTFE, BT, Getek, Aluminiomu mimọ, Ejò mimọ, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Isanra igbimọ: | 6-240 mil / 0.15-6.0mm |
| Isanra bàbà: | 210um (6oz) fun Layer ti inu 210um (6oz) fun Layer ita |
| Iwọn lilu ẹrọ min: | 0.2mm/0.08” |
| Ipin abala: | 2:1 |
| Iwọn paneli ti o pọju: | Sigle ẹgbẹ tabi awọn ẹgbẹ meji: 500mm * 1200mm |
| Awọn fẹlẹfẹlẹ pupọ: 508mm X 610mm (20 ″ X 24 ″) | |
| Ibú laini min/aaye: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Nipasẹ iho iru: | Afọju / sin / Plugged (VOP, VIP…) |
| HDI / Microvia: | BẸẸNI |
| Ipari Ilẹ: | HASL, LF HASL |
| Gold Immersion, Gold Filaṣi, ika goolu | |
| Fadaka Immersion, Tin Immersion,OSP | |
| Pipin goolu ti o yan, sisanra goolu to 3um(120u”) | |
| Erogba Print, Peelable S/M,ENEPIG | |
| Apẹrẹ: | CNC, Punching, V-ge |
| Ohun elo: | Oludanwo gbogbo agbaye |
| Flying Probe Ṣii/Onidanwo kukuru | |
| Maikirosikopu agbara giga | |
| Solderability Igbeyewo Apo | |
| Peeli Agbara idanwo | |
| Ṣii Volt giga & Oluyẹwo kukuru | |
| Cross Section igbáti Apo Pẹlu Polisher | |
